Electronic CAD Designer

• PWB layout design — Develop moderate to highly complex printed wiring board layouts using inputs from schematic designers and engineering partners

• High‑density board development — Support creation and modification of high‑density PWBs across a wide range of technologies

• Engineering collaboration — Work closely with electrical, packaging, and manufacturing engineers to align layout, fabrication criteria, and design intent

• Constraint management — Assist engineers with constraint entry, editing, and interpretation of design requirements

• Design tool proficiency — Apply advanced CAD tools to execute complex layouts and maintain accuracy throughout the design cycle

• Advanced layout techniques — Utilize differential pair routing, length matching, impedance control, blind/buried vias, and breakout strategies for fine‑pitch components

• Process adherence — Follow established workflows, work instructions, and documentation standards

• Documentation support — Provide inputs for generating associated design and manufacturing documentation

• Industry standards knowledge — Apply working knowledge of IPC‑7351, JEDEC‑JP95, MIL‑STD‑1835, and general schematic/PWB design practices

• Independent execution — Operate with moderate to minimal oversight while coordinating with multiple senior technical staff

• Issue identification — Surface design issues promptly and communicate status, risks, and progress to project teams and management

• Project delivery — Drive layout tasks efficiently and complete assignments within defined project timelines

Tools

• Siemens (Mentor) Xpedition Enterprise VX2.12/2.14

• AutoCAD

• Downstream CAM350

• SolidWorks

Required Qualifications

• Associate degree or technical certificate in a relevant discipline, or equivalent experience

• 10+ years of PWB design or technical drafting experience with applicable tool expertise

• Ability to organize and capture design details in a fast‑paced environment

• Strong verbal and written communication skills

• Effective performance in a hybrid work setting

Desired Qualifications

• Experience with bare‑die techniques including wire bond, flip chip, and interposer design

• Formal electronics or circuit theory education

• IPC certification

• Additional domain exposure in PWB assembly, fabrication, hardware assembly, or hardware testing

• Active or recent (<1 year) security clearance preferred but not required

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